Introduction Text
New materials and semiconductor technologies are advancing the performance of next-generation electronics. Fast and accurate failure analysis becomes more important than ever for all stages of the product life cycle – from R&D to yield improvement to field returns. ZEISS offers advanced 2D and 3D imaging solutions for both front-end and back-end processes. Please visit our booth #500 at ISTFA to speak with our team about our unique X-ray, FE-SEM and FIB-SEM microscopy solutions for failure analysis and process development.

Discover how GeminiSEM FE-SEM enables ultra-low voltage surface imaging and large field of view nanoprobing for your most demanding imaging and analytical tasks. See how Xradia 3D X-ray microscopes powered by artificial intelligence deliver faster scan times with images that look better than ever. Explore how Crossbeam FIB-SEM achieves single-digit-nm 3D resolution for failure analysis, constructional analysis, or metrology of the smallest logic and memory structures. Learn about our breakthrough Crossbeam laser FIB-SEM for rapid nanoscale imaging of deeply buried features in stacked die and packages and high-resolution real-time SEM control for lamella preparation.
 

EXAMPLE:

Monady, November 12

Name of the Session
8:15 – 9:00 am EST, Location: Hall 3
Speaker Session: Cheryl Hartfield, Carl Zeiss Microscopy; Thomas Moore, Waviks, Inc.