ZEISS Crossbeam Family

最先端の発見、容易な設計

高解像度電界放出型走査電子顕微鏡(FE-SEM)のイメージングと解析性能を、次世代集束イオンビーム(FIB)の処理能力と組み合わせたもZEISS Crossbeam。学術機関や産業研究所といった、複数のユーザーが利用するような機関で働く方々にもお役に立ちます。Crossbeamのモジュラープラットフォームコンセプトを利用して、既存のシステムを必要に応じてアップグレードできます。ミリング、イメージング、あるいは3D分析を実施する上で、CrossbeamによってFIBを利用する際の処理が迅速になります。

Learn in this video how the TEM lamella preparation workflow of ZEISS Crossbeam enables Benedikt Müller, University of Tuebingen, and Claus Burkhardt, NMI Reutlingen, to investigate the crystal structure of NanoSQUIDS.

Gemini電子工学を利用した高解像度SEM画像から、正しい試料情報を取得します。
イオンスカルプタFIBカラムに新たなFIB処理法を導入しています。試料へのダメージを最低限に抑えることで試料加工面の質を最大に高めると同時に、実験を迅速化します。
TEM試料の準備にはイオンスカルプタFIBの低電圧性能を利用します。アモルファス化のダメージを最低限に抑えつつ極薄の試料が得られます。
ZEISS Crossbeamシリーズに最も期待されている評価プロセスでは、低真空モードの観察機能を備えるCrossbeam 340を活用するか、高分解能観察が可能なCrossbeam 550をご利用ください。大型サイズのチャンバーを選択することで、さらにオプションの拡張性が広がります。

Advantages in FIB-SEM

SEM観察能力が大幅に改善

低加速電圧におけるSEM分解能が最大30%改善

SEM Performance

Focused Ion Beam Column of ZEISS Crossbeam

ハイスループットFIB加工が実現

インテリジェントFIBミリングストラテジーの導入により、材料加工スピードが最大40%UP

Ion-sculptor FIB

EDS Analytics in 3D with ZEISS Crossbeam

FIB-SEM 分析で3D解像度を体験

EDS とEBSD解析を統合した3D解析による利便性を体験ください。

Expand Your Crossbeam

Array of TEM lamella fabricated with automated preparation. Crossbeam 550.

The Workflow for TEM Lamella Preparation

Just do it with high quality at high throughput

ZEISS Crossbeamシリーズは、次世代型集束イオンビームカラム、イオンスカルプターを搭載しています。ハイスループットには高電流、高品質な試料作製には低加速電圧を用い、すばらしい性能を発揮します。

1. Automated navigation to the specimen’s region of interest (ROI)

Begin the workflow without time-consuming search for the ROI
Use the navigation camera on the airlock to locate specimens
The integrated user interface makes it easy to navigate to your ROI
Benefit from the large, distortion-free field of view in the SEM

Lamella of a copper sample ready for lift out

2. Automated Sample Preparation (ASP) to prepare a lamella out of the bulk

Start the preparation with a simple three-step process: ASP
Define the recipe including drift correction, deposition and coarse and fine milling
The ion optics of the FIB column enables high throughput for the workflow
Duplicate the recipe and repeat as often as required in order to start a batch preparation

Part of the TEM lamella preparation workflow in a ZEISS Crossbeam

3. Lift out

Bring in the micromanipulator and attach the lamella to its tip
Cut out the lamella from the bulk
The lamella is then ready for lift out and can be transferred to a TEM grid

TEM lamella of a silicon sample after final thinning

4. Thinning: the final step is crucial, as it defines the quality of your TEM lamella

The instrument’s design allows you to reach a desired thickness of the lamella by enabling live monitoring of the thinning
Use two detector signals in parallel to judge lamella thickness and obtain reproducible end thickness on the one hand (with the SE detector) and to control surface quality on the other hand (with the Inlens SE detector)
Prepare high quality samples with negligible amorphization

360° view of Crossbeam 550

The Technology Behind ZEISS Crossbeam

SEM Electron Optics

Choose between Two Columns

The FE-SEM column of ZEISS Crossbeams is based on Gemini electron optics as all ZEISS FE-SEMs. Decide on the Gemini VP column of Crossbeam 340 or the Gemini II column of Crossbeam 550.

Electron Optics

Gemini - Novel Optics

Profit from Surface Sensitive Imaging

High resolution imaging at low landing energy is required for beam sensitive, non-conductive samples. A two-step deceleration modus, the Tandem decel, is now introduced to ZEISS Crossbeam 550.

Novelties in Gemini Technology

FIB-SEM Technology

Discover a new way of FIB processing

The Ion-sculptor FIB column speeds up your FIB work without compromising machining precision and lets you benefit of its low voltage performance for any sample.

FIB-SEM Technology

ZEISS Crossbeam Family

ZEISS Crossbeam 340: standard chamber

ZEISS Crossbeam 550: large chamber

Within ZEISS Crossbeam Family you have the choice between Crossbeam 340 or Crossbeam 550. Exploit the variable pressure capabilities of Crossbeam 340. Or use Crossbeam 550 for your most demanding characterizations and choose the chamber size, standard or large, that best suits your samples.

	ZEISS Crossbeam 340	ZEISS Crossbeam 550
SEM	Gemini I VP optics -	Gemini II optics Tandem decel option
Chamber Size and Ports	standard with 18 ports	standard with 18 configurable ports or large with 22 configurable ports
Stage	100 mm travel range in x/y	standard with 100 mm or large 153 mm travel range in x/y
Charge Control	Flood Gun Local Charge Compensation Variable Pressure	Flood Gun Local Charge Compensation -
Exemplified Options	Inlens Duo for sequential SE/EsB* imaging VPSE detector	Inlens SE and Inlens EsB* for simultaneous imaging SE/EsB* imaging large airlock for 8 inch wafers configure three pneumatically driven accessories simultaneously on the large chamber, e.g. STEM, 4-Quadrant-Backscatter detetor, and local charge compensation
Advantages	Maximum sample variety due to variable pressure mode, wide range of in situ experiments, sequential Inlens SE / EsB* imaging possible.	High throughput in analytics and imaging, high resolution under all conditions, simultaneous Inlens SE and Inlens EsB* imaging.
		^{* SE secondary electron, EsB energy selective backscatter}

Application Examples

Images

High resolution at FIB-SEM coincidence

The point where the stage and SEM- and FIB beam join for FIB patterning, deposition or milling: Alumina nanospheres imaged at 1 kV with Tandem decel.

Alumina spheres imaged with
Tandem decel on Crossbeam 550

Cross-sectioning with 100 nA

The FIB column of the ZEISS Crossbeam Family is uniquely equipped with a beam current of 100 nA. This trench is milled in silicon, dimensions 100 × 30 × 25 μm³, milling time 10 minutes using 100 nA FIB current. Note the precision of the structure.

Trench milled with 100 nA beam current

Comparison of milling strategies in silicon:

Material removal with conventional milling (left) takes 10 min 54 sec whereas with Fastmill the same amount of material is removed in 7 min 21 sec (right). With Fastmill, a newly-introduced scanning strategy, milling speed is enhanced by optimally exploiting the angle-dependent sputtering effect. Fastmill enables up to 40% faster milling than regular line milling.

Comparison of milling strategies on Crossbeam 550

Precise sample preparation in a dense matrix

TEM-Lamella of a silver/nickel/copper-layered system ready for lift out, fabricated with automatic sample preparation.

TEM lamella in Ag-Ni-Cu multi-layer system

Preparation of batches

Array of TEM lamellae fabricated with automated preparation.

Batch of 35 TEM lamellae

EDS analysis at very high resolution with STEM

Chromium carbides at the grain boundary of thermally-affected X2CrNi18-10 steel: STEM BF (left), EDS chromium map (right).

STEM image and EDS elemental map
of Cr depletion in steel

Nanopatterning:
Nanofluidics channels fabricated by FIB in a silicon master stamp (left).
Detail: meander- shaped channel (center). Inlets and outlets have a funnel shape (right).
Courtesy of: I. Fernández-Cuesta, INF Hamburg, Germany.

Nanofluidic channels, master stamp

Nanofluidic channels, master stamp

Nanofluidic channels, meander-shaped channels

Nanofluidic channels, meander-shaped channels

Nanofluidic channels, funnel-shaped inlets and outlets

Nanofluidic channels, funnel-shaped inlets and outlets
Videos

Live imaging of FIB-milling a spiral in silicon
Imaged with the SEM using an Inlens detector.

3D tomogram of a solid oxide fuel cell
The SOFC’s anode is made of a heat resistant composite material: Nickel Samaria-doped Ceria.

Investigation of a lead free solder containing Cu and Ag particles in an Sn matrix

Tomography data of SEM images were acquired at 1.8 kV
Courtesy of: M. Cantoni, EPFL Lausanne, Switzerland.

Elemental mapping: EDS maps were acquired at 6 kV, using Atlas 5 Analytics.Courtesy of: M. Cantoni, EPFL Lausanne, Switzerland.

FIB-Tomography in Life Sciences

Cell Biology – Algae
3D reconstruction of a vitrified Emiliania huxleyi coccolithophore obtained from a cryo-FIB-SEM image series. The 3D reconstruction shows the immature coccolith (in yellowish), a coccolith in statu nascendi (blue) and lipid bodies (red).
Courtesy: L. Bertinetti, Max-Planck Institute of Colloids and Interfaces, Potsdam, DE and A. Scheffel, Max-Planck Institute Plant Physiology, Potsdam, DE.

Neuroscience – Brain Sections
Large area milling and imaging of a brain section with the 3D module of ZEISS Atlas 5. High current allows fast milling and imaging of large fields of view up to 150 μm in width. The depicted brain image has a field of view of 75 μm in width and the sample was milled with a beam current of 20 nA.
Courtesy: C. Genoud, FMI Basel, CH.

Software

ZEISS Atlas 5 – Master Your Multi-scale Challenge

Atlas 5 は仕事の負荷を減らします。：様々なスケール、形式の画像で試料自体に相関する包括的な環境を構築します。 Atlas 5 はパワフルで直感的なハードウェアとソフトウェアのパッケージで、集束イオンビームSEMの可能性を拡張します。

X線顕微鏡とFIB-SEMの相関： X線のデータを用いて、試料表面下の領域をFIBのターゲットとして3Dで特定 -そのままでは視認できなくても狙えます。

FIBｰSEMアプリケーションに特化した2つの専用モジュール：3D Tomography モジュールが３Dのデータスタックを自動的に構築。ナノパターニングとプロトタイピングの複雑な課題にも、高度なナノパターニングと視覚化のためのエンジン（NPVE Advanced）で対応。

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可視化および解析ソフトウェア

ZEISS は Object Research Systems (ORS) の Dragonfly Pro をお奨めします。

X-線、FIBｰSEM、SEM、ヘリウムイオン顕微鏡など、様々なテクノロジーで取得された3Dデータのための高度な解析と視覚化を行うソフトウェアです。
Visual SI Advanced の後継となる Dragonfly Pro は高品質の視覚化テクニックと優れたグラフィックを提供します。使い易い Python のスクリプトにより Dragonfly Pro はカスタマイズ可能です。 3Dデータの処理とワークフローをトータルでコントロールできるようになります。

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