ZEISS Crossbeam Family

Discovering and Designing Advanced Materials With Ease

With ZEISS Crossbeam you benefit from a 3D nano-workstation

Combine imaging and analytical performance of a field emission scanning electron microscope (FE-SEM) with the processing ability of a focused ion beam (FIB).

During milling, imaging or when performing 3D analytics, Crossbeam will speed up your FIB applications. Make the most of your 3D analytics with the new EDS module.

Decide on exploiting variable pressure capabilities with ZEISS Crossbeam 340. Or use Crossbeam 550 for your most demanding characterizations.

Enjoy more options with the large chamber now.

Advantages in FIB-SEM

Maximize Your SEM Insights

Take advantage of achieving up to 30% better SEM resolution at low voltage.

SEM Performance

Focused Ion Beam Column of ZEISS Crossbeam

Increase Your FIB Sample Throughput

Profit from up to 40% faster material removal by the introduction of intelligent FIB milling strategies.

Ion Beam Current

EDS Analytics in 3D with ZEISS Crossbeam

Experience Best 3D Resolution in Your FIB-SEM Analysis

Enjoy the benefits of integrated 3D EDS analysis.

Expand Your Crossbeam

360° view of Crossbeam 550

The Technology Behind ZEISS Crossbeam

SEM Electron Optics

Choose between Two Columns

The FE-SEM column of ZEISS Crossbeams is based on Gemini electron optics as all ZEISS FE-SEMs. Decide on the Gemini VP column of Crossbeam 340 or the Gemini II column of Crossbeam 550.

Electron Optics

Gemini - Novel Optics

Profit from Surface Sensitive Imaging

High resolution imaging at low landing energy is required for beam sensitive, non-conductive samples. A two-step deceleration modus, the Tandem decel, is now introduced to ZEISS Crossbeam 550.

Novelties in Gemini Technology

FIB-SEM Technology

Discover the only FIB with 100 nA Current

ZEISS Crossbeam‘s focused ion beam comes with 100 nA current. Speed up your FIB work without compromising machining precision.

FIB-SEM Technology

See the Difference

Slide between high resolution imaging with and without Tandem decel

ZEISS Crossbeam image of reference sample without Tandem decel

ZEISS Crossbeam image of reference sample with Tandem decel

Better SEM Resolution with Tandem decel and high gun resolution mode:

Reference sample, gold nanoparticles on carbon, is imaged without (left) and with (right) Tandem decel at 1 kV landing energy at 5 mm working distance, corresponding to the working distance at which FIB milling and simultaneous SEM imaging takes place.

ZEISS Crossbeam Family

ZEISS Crossbeam 550: standard chamber

ZEISS Crossbeam 550: large chamber

Within ZEISS Crossbeam Family you have the choice between Crossbeam 340 or Crossbeam 550. Exploit the variable pressure capabilities of Crossbeam 340. Or use Crossbeam 550 for your most demanding characterizations and choose the chamber size, standard or large, that best suits your samples.

	ZEISS Crossbeam 340	ZEISS Crossbeam 550
SEM	Gemini I VP optics -	Gemini II optics Tandem decel option
Chamber Size and Ports	standard with 18 ports	standard with 18 configurable ports or large with 22 configurable ports
Stage	100 mm travel range in x/y	standard with 100 mm or large 153 mm travel range in x/y
Charge Control	Flood Gun Local Charge Compensation Variable Pressure	Flood Gun Local Charge Compensation -
Exemplified Options	Inlens Duo for sequential SE/EsB* imaging VPSE detector	Inlens SE and Inlens EsB* for simultaneous imaging SE/EsB* imaging large airlock for 8 inch wafers configure three pneumatically driven accesories simultaneously on the large chamber, e.g. STEM, 4-Quadrant-Backscatter detetor, and local charge compensation
Advantages	Maximum sample variety due to variable pressure mode, wide range of in situ experiments, sequential Inlens SE / EsB* imaging possible.	High throughput in analytics and imaging, high resolution under all conditions, simultaneous Inlens SE and Inlens EsB* imaging.
		^{* SE secondary electron, EsB energy selective backscatter}

Application Examples

Images

High resolution at FIB-SEM coincidence

The point where the stage and SEM- and FIB beam join for FIB patterning, deposition or milling: Alumina nanospheres imaged at 1 kV with Tandem decel.

Alumina spheres imaged with
Tandem decel on Crossbeam 550

Cross-sectioning with 100 nA

The FIB column of the ZEISS Crossbeam Family is uniquely equipped with a beam current of 100 nA. This trench is milled in silicon, dimensions 100 × 30 × 25 μm³, milling time 10 minutes using 100 nA FIB current. Note the precision of the structure.

Trench milled with 100 nA beam current

Comparison of milling strategies in silicon:

Material removal with convential milling (left) takes 10 min 54 sec whereas with Fastmill the same amount of material is removed in 7 min 21 sec (right). With Fastmill, a newly-introduced scanning strategy, milling speed is enhanced by optimally exploiting the angle-dependent sputtering effect. Fastmill enables up to 40% faster milling than regular line milling.

Comparison of milling strategies on Crossbeam 550

Precise sample preparation in a dense matrix

TEM-Lamella of a silver/nickel/copper-layered system ready for lift out, fabricated with automatic sample preparation.

TEM lamella in Ag-Ni-Cu multi-layer system

Preparation of batches

Array of TEM lamellae fabricated with automated preparation.

Batch of 35 TEM lamellae

EDS analysis at very high resolution with STEM

Chromium carbides at the grain boundary of thermally-affected X2CrNi18-10 steel: STEM BF (left), EDS chromium map (right).

STEM image and EDS elemental map
of Cr depletion in steel

Nanopatterning:
Nanofluidics channels fabricated by FIB in a silicon master stamp (left).
Detail: meander- shaped channel (center). Inlets and outlets have a funnel shape (right).
Courtesy of: I. Fernández-Cuesta, INF Hamburg, Germany.

Nanofluidic channels, master stamp

Nanofluidic channels, master stamp

Nanofluidic channels, meander-shaped channels

Nanofluidic channels, meander-shaped channels

Nanofluidic channels, funnel-shaped inlets and outlets

Nanofluidic channels, funnel-shaped inlets and outlets
Videos

Live imaging of FIB-milling a spiral in silicon

Imaged with the SEM using an Inlens detector.

A sample holder designed for ZEISS FIB-SEMs to prepare TEM-lamellae

The patented X²-preparation method is used to prepare ultra-thin, stable TEM lamellae with a homogenous thickness of less than 10 nm without causing sample damage.

Investigation of a lead free solder containing Cu and Ag particles in an Sn matrix

Tomography data of SEM images were acquired at 1.8 kV
Courtesy of: M. Cantoni, EPFL Lausanne, Switzerland.

Elemental mapping: EDS maps were acquired at 6 kV, using Atlas 5 Analytics.Courtesy of: M. Cantoni, EPFL Lausanne, Switzerland.

Software

ZEISS Atlas 5 – Master Your Multi-scale Challenge

Atlas 5 は仕事の負荷を減らします。：様々なスケール、形式の画像で試料自体に相関する包括的な環境を構築します。 Atlas 5 はパワフルで直感的なハードウェアとソフトウェアのパッケージで、集束イオンビームSEMの可能性を拡張します。

X線顕微鏡とFIB-SEMの相関： X線のデータを用いて、試料表面下の領域をFIBのターゲットとして3Dで特定 -そのままでは視認できなくても狙えます。

FIBｰSEMアプリケーションに特化した2つの専用モジュール：3D Tomography モジュールが３Dのデータスタックを自動的に構築。ナノパターニングとプロトタイピングの複雑な課題にも、高度なナノパターニングと視覚化のためのエンジン（NPVE Advanced）で対応。

詳しく見る

可視化および解析ソフトウェア

ZEISS は Object Research Systems (ORS) の Dragonfly Pro をお奨めします。

X-線、FIBｰSEM、SEM、ヘリウムイオン顕微鏡など、様々なテクノロジーで取得された3Dデータのための高度な解析と視覚化を行うソフトウェアです。
Visual SI Advanced の後継となる Dragonfly Pro は高品質の視覚化テクニックと優れたグラフィックを提供します。使い易い Python のスクリプトにより Dragonfly Pro はカスタマイズ可能です。 3Dデータの処理とワークフローをトータルでコントロールできるようになります。

詳しくはこちら